金子 豊  助教

京都大学大学院情報学研究科
複雑系科学専攻
606-8501 京都市左京区吉田本町

電話 075-753-5880
FAX: 075-753-4923
Email: kaneko@acs.i.kyoto-u.ac.jp

オフィス:総合研究8号館203号室


平成253月現在

研究活動

 

o    金子豊、樋渡保秋、小原勝彦、村上透、
薄膜成長のモンテカルロシミュレーション − 表面構造と格子欠陥 −
表面技術、第51巻、1号、pp 81--86(2000).

o    Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami,
Monte Carlo Simulation of Thin Film Growth with Lattice Defects
Journal of the Physical Society of Japan, Vol. 69, No. 11, pp3607-3613 (2000).

o    Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami,
Computer Simulation of Crystal Growth and Void Formation
Statistical Physics (AIP Conference Proceedings 519), pp575-577 (2000).

o    Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami,
Surface Structure and Void Formation in Thin Film Growth : A Monte Carlo Simulation
Prog. Theor. Phy. Suppl., No.138, pp126-127 (2000).

o    Y. Hiwatari, Y. Kaneko, K. Ohara and T. Murakami,
Kinetic Monte Carlo Simulation of Thin Film Growth with Void Formation  - Application to Via Filling

 Technical Proceedings of the Fifth International Conference on Modeling and Simulation of Microsystems, pp430-433,
  (Computational Publications, Boston, Geneva, San Francisco, 2002)

o    金子豊、樋渡保秋、小原勝彦、村上透、
 
欠陥生成を取り入れた薄膜成長のモンテカルロシミュレーション − 孔埋め込みへの応用 −
 
表面技術、第53巻、4号、pp 28--33(2002).

o    Y. Kaneko and Y. Hiwatari, 
 
The Solid-by-Solid Model for Crystal Growth and Electroplating : Kinetic Monte Carlo Simulation
 
Recent Research and Development of Physics and Chemistry of Solids (Transworld Research Network), pp.47-64 (2003).

o    Y. Kaneko, Y. Hiwatari, K. Ohara and T. Murakami,
 
Computer Simulation of Thin Film Growth and Defect Formation
 
Surface and Coating Technology (Elsevier), pp215-218 (2003).

o    Y. Kaneko, Y. Hiwatari and K. Ohara,
 
Monte Carlo Simulation of Thin Film Growth with Defect Formation : Application to Via Filling
 
Molecular Simulation, 30, No.13-15, pp895-899 (2004).

o    Y. Hiwatari, Y. Kaneko and H. Ishida
 
Molecular Simulation for Nanotechnologies : Application to Industry
 
Molecular Simulation, 30, No.13-15, pp819-826 (2004).

o    Y. Kaneko, T. Mikami, Y. Hiwatari, and K. Ohara
Computer Simulation of Electrodeposition : Hybrid of Molecular Dynamics and Monte Carlo
 
Molecular Simulation, 31, No.6-7, pp429-433 (2005).

o    Y. Kaneko, Hiwatari, K. Ohara and F. Asa
Monte Carlo Simulation of Damascene Electroplationg: Effects of Additives
 
Molecular Simulation, 32, No.15, pp1227-1232 (2007).

o    Y. Hiwatari, Y. Kaneko, T. Mikami, K. Ohara and F. Asa
Molecular Dynamics-Monte Carlo Hybrid Simulation of Thin Film Growth and Void Formation in Electrodeposition Process
 
Molecular Simulation, 33, No.1-2, pp133-138 (2007).

o    Y. Kaneko, Hiwatari, K. Ohara and F. Asa
Kinetic Monte Carlo Simulation of Via Filling : Role of Chloride Ions
ECS Transaction
Phoenix, AZ , Vol. 13, pp.1-9, 2008

o    Y. Kaneko, Hiwatari, K. Ohara and F. Asa
Monte Carlo and Molecular Dynamics Studies of the Effects of Additives in Electrodepositio
Journal of the Korean Physical Society,  Vol. 54, No. 3, pp.1207- 1211, 2009

o    Molecular Simulation Approach to the Effects of Additives in Electrodeposition Process
Nishimura, Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
ECS Transaction - Honolulu, HI -  16(46) (2009) pp.83-92

o    Simulation of Three-Dimensional Solid-by-Solid Model and Application to Electrochemical Engineering
 Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
 ECS Transaction - Vancouver, CANADA - 28(29) (2010) pp.1-7.

o    Kinetic Monte Carlo Approach to the Effects of Additives in Electrodeposition
Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
ECS Transaction - Montreal, CANADA - 35(27) (2011) pp.7-12.

o    Kinetic Monte Carlo simulation of three-dimensional shape evolution using Solid-by-Solid model: Application to via and trench filling
 Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
 Electrochimica Acta (2013)
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